Sony recently performed a software refresh on its PS5 console with a new variant known as CFI-1202 which offers lower temperatures and input power. The new console is lighter, runs cooler and consumes less power and it’s all thanks to the updated AMD Obreon Plus SOC hailing the 6nm TSMC process node.
Sony’s “CFI-1202” PS5 Console Variant Features Improved 6nm AMD Oberon Plus SOC: Reduced Die Size, Reduced Power and Cooler Operation
In a recent teardown video posted by Austin Evans, the Techtuber noticed that the Sony PS5 console came in a new lighter, cooler, and less power-hungry variant. This new PS5 variant is labeled “CFI-1202” and now we can see why it is so much better than Sony’s original PS5 variants (CFI-1000 / CFI-1001).
Tech outlet, Angstronomics, has confirmed in its exclusive that the Sony PS5 (CFI-1202) comes with an upgraded AMD Oberon SOC known as Oberon Plus which uses the TSMC N6 (6nm) process. TSMC has made its 7nm Process Node (N7) compatible with EUV (N6) 6nm Node design rules. This allows TSMC partners to easily transition existing 7nm chips to the 6nm node without encountering major complexities. The N6 process node offers an increase in transistor density of 18.8% and also reduces power consumption, which in turn reduces temperatures.
This is why the new Sony PS5 consoles are lighter and have a smaller heatsink compared to the launch variants. But that’s not all, we also see a brand new chip from the AMD Oberon Plus SOC sitting alongside the 7nm Oberon SOC. The new die is approximately 260mm2, which represents a 15% reduction in die size compared to the Oberon 7nm SOC (~300mm2). Another benefit of moving to 6nm is the number of chips that can be produced on a single wafer. The outlet reports that each Oberon Plus SOC wafer can produce around 20% more chips at the same cost.
This means that without affecting their cost, Sony can offer more Oberon Plus chips for use in the PS5 and this can further reduce the market shortages that current-gen consoles have faced since launch. It is also reported that TSMC will phase out 7nm Oberon SOCs in the future and switch entirely to 6nm Oberon Plus SOCs, resulting in 50% more chips being manufactured per wafer. Microsoft is also expected to use the 6nm process node for its updated Arden SOC in the future for its Xbox Series X consoles.
News source: Angstronomics
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