JOHANNESBURG, South Africa, June 11, 2021 – Samsung, a global leader in advanced memory technology, announced that it has developed the industry’s first high-bandwidth memory (HBM) integrated with the processing power of artificial intelligence ( IA) – HBM-PIM. New In-Memory Processing (PIM) Architecture Brings Powerful AI Computing Capabilities In High-Performance Memory, To Accelerate Large-Scale Processing In Data Centers, High-Performance Computing (HPC) Systems And Applications AI-enabled mobiles.
Kwangil Park, senior vice president of memory product planning at Samsung Electronics, said, “Our revolutionary HBM-PIM is the industry’s first programmable PIM solution designed for various AI-based workloads such as HPC. , training and inference. We plan to leverage this breakthrough by further collaborating with AI solution providers for even more advanced PIM-based applications. “
Rick Stevens, Associate Director of the Argonne Laboratory for Computing, Environment and Life Sciences, said: “I am delighted to see that Samsung is meeting the challenges of bandwidth and memory power. for HPC computation and AI. The HBM-PIM design has demonstrated impressive performance and power gains on important classes of AI applications, so we look forward to working together to assess its performance on other issues of interest to the national lab. from Argonne.
Most of today’s computer systems are based on the von Neumann architecture, which uses separate processor and memory units to perform millions of complex data processing tasks. This sequential processing approach requires data to constantly move back and forth, resulting in a bottleneck that slows down the system, especially when dealing with ever-increasing volumes of data.
Instead, the HBM-PIM brings processing power directly to where data is stored by placing a DRAM-optimized AI engine inside each memory bank – a storage subunit – enabling processing. parallel and minimizing data movement. When applied to Samsung’s existing HBM2 Aquabolt solution, the new architecture is able to deliver more than twice the system performance while reducing power consumption by over 70%. The HBM-PIM also does not require any hardware or software modifications, allowing for faster integration into existing systems.
Samsung’s article on HBM-PIM has been selected for presentation at the renowned International Semiconductor Circuit Virtual Conference (ISSCC) which ran through February 22. Samsung’s HBM-PIM is currently being tested in AI accelerators by major AI solution partners, with all validations expected to be completed in the first half of this year.