Samsung Electronics co-CEO Qing Guixian reportedly recently visited Taiwan in a “low-key” manner, according to a new UDN report.
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It was reported that his first priority was to promise Samsung’s HBM (High Bandwidth Memory), used in AI GPUs; the faster and more, the better. Samsung has focused on promoting high-end DRAM technologies, including HBM (next-generation HBM3, HBM3E and HBM4) and DDR5, for which it needs help from Taiwanese ODM manufacturers, by expanding outsourcing of mature and niche products.
Samsung met with Werder, a subsidiary of TSMC and the Quanta group, reports UDN. According to the sources, Samsung’s co-CEO had “two main tasks during this trip”: promoting Samsung’s HBM and possible AI cooperation with Taiwanese manufacturers.
UDN reports that “the outside world is optimistic that Samsung has invested in the development of AI server hardware in order to develop generative AI tools. In terms of AI cooperation, there are plans to have further cooperation with Werder. Werder will welcome a new order. business opportunities for Samsung’s AI servers.
Qing Guixian is the boss of Samsung’s semiconductor business, and he leads the Device Solutions (DS) Department, including the semiconductor business, and serves as the director of the Samsung Advanced Institute of Technology ( KNOWS). He is a very busy man, so it makes sense to note why he is an important figure when he visits Taiwan.
Samsung has been working hard to bring its HBM business into the arena to better combat its South Korean rival SK hynix, with a dedicated HBM team that will increase HBM memory production nearly 3-fold this year. Samsung will also begin mass production of its 12-layer HBM memory, as well as its 128-bit HBM memory using 32 GB chips.
Winbond obtained a “big red envelope” (money) from Samsung, and a range of memory was adopted by many Samsung terminals. The AMOLED panels inside Samsung smartphones feature external NOR chips supplied by Winbond, for example.
Winbond’s large orders from Samsung will include DDR3 and DDR4 memory, with production capacity remaining stable before production curtailment begins. Samsung has been slowly eliminating DDR3 memory from the market, but has expanded its outsourcing strategy, so DDR3 memory continues to live on with Winbond’s new contract.
Winbond General Manager Chen Peiming estimated that the DDR3 supply and demand market will equalize in the second or third quarter of 2024, which is not far away and will obviously benefit Winbond’s operations.
